对于纳米和微米结构薄膜和板材的批量生产,我们采用了各种紫外线滚轴压印设备。这实现了卷对卷 (R2R) 或卷对板 (R2P) 工艺。
这可用于生产 36 µm 至 250 µm 厚和最大 1150 mm 宽的薄膜。其中最大结构宽度为 1050 mm。它可以加工出从几纳米到 200 µm 的结构。根据结构,压印速度介于 2 m/min 至 50 m/min 之间
temicon specifically uses the UV nanoimprint lithography (UV-NIL) process. For this, a UV-curing polymer layer is used.
While the surface with the initially still uncured polymer layer is in contact with the imprint tool on the roll-to-roll system, the nanostructures or microstructures are transferred to the surface by means of UV light.
Which nano- or microstructures would you like for your products? Call us! Benefit from our expertise