模板制作

我们采用激光干涉光刻和紫外线光刻实现大量的微米结构和纳米结构。通过这些技术，可以对 200nm 和几百微米范围内的结构进行制模。

激光干涉光刻将周期性或随机结构模板无缝实现在最大 1m² 的面积上。通过紫外线光刻可以将任意形状的微结构加工到最大 20" x 24” 的面积上。

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temicon uses UV lithography as a mastering process for microstructures of more than 1 µm structure size. Through UV lithography, microstructures of any geometry can be processed on an area of up to 20" x 24".

Special features of temicon technology are e.g. large formats in the square meter range, high aspect ratio of more than 2.0, sidewall angles of 85° ± 2°, which allow demolding of the structure in the production process or gapless microlens arrays.

Due to these innovations, we realize a particularly wide range of microstructures with customized functions for our customers. A production line for UV photolithography for wafer sizes up to 200 mm is installed in our 400 m² clean room. This also includes resist coating, exposure, wet processes and sputtering.

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